CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Posted Date:
Feb 12, 2026
Feb 26, 2026
Awarded Date:
No Awarded Date
| SetAside Type | ||
| Solicitation ID | Solicitation Title | Solicitation Office |
| 1333ND26QNB030031 | CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | |
| Synopsis | ||
|
See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details. .... Read More |
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| Office Location | Agency Name | Solicitation Base Posting Type |
| NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | Combined Synopsis/Solicitation | |
