CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Posted Date:
Apr 15, 2026
Apr 30, 2026
Awarded Date:
Apr 15, 2026
| SetAside Type | ||
| Solicitation ID | Solicitation Title | Solicitation Office |
| 1333ND26PNB030089 | CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | |
| Synopsis | ||
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Contract awarded in accordance with the solicitation evaluation criteria of the proposed item that offerred the best value to the Government. .... Read More |
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| Office Location | Agency Name | Solicitation Base Posting Type |
| NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | AWARD Notice | |
